Intel retweeted
Advancing semiconductor performance isn't just about smaller transistors.
Innovations in advanced packaging, like hybrid bonding, enable denser chip-to-chip connections and create new opportunities for performance and power efficiency. But bringing these technologies to life manufacturing precision.
Discover the engineering behind next-generation semiconductor packaging.
Watch the full conversation: ms.spr.ly/6011axei1
#IntelFoundry
Innovations in advanced packaging, like hybrid bonding, enable denser chip-to-chip connections and create new opportunities for performance and power efficiency. But bringing these technologies to life manufacturing precision.
Discover the engineering behind next-generation semiconductor packaging.
Watch the full conversation: ms.spr.ly/6011axei1
#IntelFoundry
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@onchainantonio Great point. PQC shouldn't be treated as a software-only migration. In the report, we cover how we're bringing quantum-resistant authentication into firmware and platform security, since some of the longest-lived trust anchors are rooted in hardware.
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@magicsilicon Looks like @OscarPiastri added a few extra cores for race weekend 👀
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Meeting sovereignty requirements shouldn't limit possibilities. Together with @Microsoft, we're helping organizations balance control, security, and flexibility across their workloads.
Digital sovereignty requirements vary by workload, and they keep changing. Microsoft and @intel are building a consistent foundation from edge to cloud, so you can run AI where your data lives, with controls you can verify.
Learn more: msft.it/6014avTTa
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Performance isn’t just achieved, it’s engineered.
Check out @OscarPiastri’s limited-edition @McLarenF1 & Intel helmet this weekend in Austin.
Check out @OscarPiastri’s limited-edition @McLarenF1 & Intel helmet this weekend in Austin.
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Security is evolving. So are the technologies that protect our data.
Learn how Intel is advancing trusted computing through innovations in confidential AI, post-quantum cryptography, and more.
Read the full 2026 report: ms.spr.ly/6015aaXRJ
Learn how Intel is advancing trusted computing through innovations in confidential AI, post-quantum cryptography, and more.
Read the full 2026 report: ms.spr.ly/6015aaXRJ
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Catch @OscarPiastri if you can. He’ll be rocking a new look at the race in Austin, courtesy of our partnership with @McLarenF1.
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@trossenrobotics And thank you, @trossenrobotics, for putting Intel-powered physical AI on display!
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@dwarkesh_sp Thank you, Dwarkesh, both for spending time with us in Oregon and for featuring so many Intel leaders on the podcast! We appreciate the opportunity to showcase the latest in semiconductor manufacturing and hope listeners enjoy the discussion as much as we did.
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Intel retweeted
I spent two days touring Intel’s most advanced fab and talking to its technical leadership to understand what the chips of the future will look like.
A lot of what's coming next – gate-all-around transistors, backside power, CFET, hybrid bonding – is hard to follow without we made all the awesome animated explainers that I wish I had while I was prepping.
I also asked Intel’s leadership how the semiconductor industry will cope with the enormous shock in demand from AI.
AI compute has grown 3x a year for the last decade, but according to Intel's CTO, Intel could only double leading-edge wafer production with today’s global stock of chipmaking tools.
What kinds of tricks can foundries pull to extend this crossover point where demand surges way ahead of supply?
This was a totally new format for us - hope you enjoy!
0:00:00 – Intro
0:00:47 – How Intel brings up a new process node
0:03:22 – What Intel learned from 10nm
0:06:28 – From planar transistors to gate-all-around
0:13:13 – Why High-NA EUV pays off for Intel but not TSMC
0:19:20 – Could chips have evolved completely differently?
0:23:33 – Inside Intel's "Hot Topics" meeting
0:29:30 – Replacing copper wires with ruthenium
0:32:41 – Why stacked transistors take a decade to ship
0:39:45 – Hybrid bonding and the chip-to-chip bottleneck
0:48:00 – There aren't enough tools to 10x chip production
0:53:14 – Can Intel catch up to TSMC?
1:01:02 – Terafab, and rethinking the fab from scratch
A lot of what's coming next – gate-all-around transistors, backside power, CFET, hybrid bonding – is hard to follow without we made all the awesome animated explainers that I wish I had while I was prepping.
I also asked Intel’s leadership how the semiconductor industry will cope with the enormous shock in demand from AI.
AI compute has grown 3x a year for the last decade, but according to Intel's CTO, Intel could only double leading-edge wafer production with today’s global stock of chipmaking tools.
What kinds of tricks can foundries pull to extend this crossover point where demand surges way ahead of supply?
This was a totally new format for us - hope you enjoy!
0:00:00 – Intro
0:00:47 – How Intel brings up a new process node
0:03:22 – What Intel learned from 10nm
0:06:28 – From planar transistors to gate-all-around
0:13:13 – Why High-NA EUV pays off for Intel but not TSMC
0:19:20 – Could chips have evolved completely differently?
0:23:33 – Inside Intel's "Hot Topics" meeting
0:29:30 – Replacing copper wires with ruthenium
0:32:41 – Why stacked transistors take a decade to ship
0:39:45 – Hybrid bonding and the chip-to-chip bottleneck
0:48:00 – There aren't enough tools to 10x chip production
0:53:14 – Can Intel catch up to TSMC?
1:01:02 – Terafab, and rethinking the fab from scratch
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What does it really take to make the world's most advanced chips?
Thousands of intricate manufacturing steps. Extraordinary engineering precision. And an industry working to meet growing global demand for computing.
Get an inside look at Intel's semiconductor innovation as ade, and other Intel experts join @dwarkeshpodcast to explore the science, technology, and manufacturing expertise behind advanced chips.
Watch the full conversation: ms.spr.ly/6014aaFMm
Thousands of intricate manufacturing steps. Extraordinary engineering precision. And an industry working to meet growing global demand for computing.
Get an inside look at Intel's semiconductor innovation as ade, and other Intel experts join @dwarkeshpodcast to explore the science, technology, and manufacturing expertise behind advanced chips.
Watch the full conversation: ms.spr.ly/6014aaFMm
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