Advancing semiconductor performance isn't just about smaller transistors.

Innovations in advanced packaging, like hybrid bonding, enable denser chip-to-chip connections and create new opportunities for performance and power efficiency. But bringing these technologies to life manufacturing precision.

Discover the engineering behind next-generation semiconductor packaging.

Watch the full conversation: ms.spr.ly/6011axei1

#IntelFoundry

Meeting sovereignty requirements shouldn't limit possibilities. Together with @Microsoft, we're helping organizations balance control, security, and flexibility across their workloads.

Performance isn’t just achieved, it’s engineered.
Check out @OscarPiastri’s limited-edition @McLarenF1 & Intel helmet this weekend in Austin.

Security is evolving. So are the technologies that protect our data.

Learn how Intel is advancing trusted computing through innovations in confidential AI, post-quantum cryptography, and more.

Read the full 2026 report: ms.spr.ly/6015aaXRJ

OP's US GP lid with @intel ✨

#McLarenF1 | #UnitedStatesGP 🇺🇸

Catch @OscarPiastri if you can. He’ll be rocking a new look at the race in Austin, courtesy of our partnership with @McLarenF1.

It's go time!

I spent two days touring Intel’s most advanced fab and talking to its technical leadership to understand what the chips of the future will look like.

A lot of what's coming next – gate-all-around transistors, backside power, CFET, hybrid bonding – is hard to follow without we made all the awesome animated explainers that I wish I had while I was prepping.

I also asked Intel’s leadership how the semiconductor industry will cope with the enormous shock in demand from AI.

AI compute has grown 3x a year for the last decade, but according to Intel's CTO, Intel could only double leading-edge wafer production with today’s global stock of chipmaking tools.

What kinds of tricks can foundries pull to extend this crossover point where demand surges way ahead of supply?

This was a totally new format for us - hope you enjoy!

0:00:00 – Intro
0:00:47 – How Intel brings up a new process node
0:03:22 – What Intel learned from 10nm
0:06:28 – From planar transistors to gate-all-around
0:13:13 – Why High-NA EUV pays off for Intel but not TSMC
0:19:20 – Could chips have evolved completely differently?
0:23:33 – Inside Intel's "Hot Topics" meeting
0:29:30 – Replacing copper wires with ruthenium
0:32:41 – Why stacked transistors take a decade to ship
0:39:45 – Hybrid bonding and the chip-to-chip bottleneck
0:48:00 – There aren't enough tools to 10x chip production
0:53:14 – Can Intel catch up to TSMC?
1:01:02 – Terafab, and rethinking the fab from scratch

What does it really take to make the world's most advanced chips?

Thousands of intricate manufacturing steps. Extraordinary engineering precision. And an industry working to meet growing global demand for computing.

Get an inside look at Intel's semiconductor innovation as ade, and other Intel experts join @dwarkeshpodcast to explore the science, technology, and manufacturing expertise behind advanced chips.

Watch the full conversation: ms.spr.ly/6014aaFMm

Precision comes from preparation.
@McLarenF1 and @OscarPiastri, it’s go time.

Precision comes from preparation.
@McLarenF1 and @OscarPiastri, it’s go time.

Building semiconductor leadership requires innovation and the manufacturing capacity to bring it to scale.

In a new piece, Naga Chandrasekaran shares how Intel Foundry is expanding that capacity across the U.S., including progress on our Ohio site, where the initial major en installed on first fab.

Read more: ms.spr.ly/6015aauoh

Stuck in a stadium concession line when your team scores? The University of Alabama is using @TheWaitTimes' AI on Intel Xeon CPUs to monitor crowd flow in real time.

Processing data locally at the edge provides secure, instant analytics, enabling the stadium to shift staff, nd get fans back to their seats faster so they don’t miss a minute of the action.

Learn more: ms.spr.ly/6015avYPW

Every prompt has its place. So how do we match each AI request to the right model and compute?

Watch Nicolas Dube’s #OCPSummit26 keynote, “Put Every Prompt in Its Place,” to explore the role of open infrastructure in scaling AI: ms.spr.ly/6012avVQE

Look closely. Actually, good luck with that.
Three days until our next launch with @McLarenF1.

Nanoseconds in the lab. Milliseconds on the track.

The most detail-focused collab in engineering is heading to Austin with exciting news in the trunk. @McLarenF1

Gridiron, meet silicon.

Intel, the San Francisco @49ers, and ai.io are rewriting how technology fuels human performance. Coming soon.

Deploying AI at the edge means solving for more than performance alone. In federal and aerospace environments, factors like connectivity, power, security, and reliability can all shape how AI is deployed.

What is the biggest challenge when scaling AI at the edge?

Solve problems.

Lead with value.

Treat your people right.

We can’t guarantee a good night’s sleep, but it’s a good start.

Catch CEO @LipBuTan1’s thoughts on leadership and adding value here: ms.spr.ly/6015aUw2W