Building semiconductor leadership requires both innovation and the manufacturing capacity to bring it to scale.

In his latest piece, Naga Chandrasekaran highlights Intel Foundry’s growing U.S. footprint, including progress on our Ohio site.

Read more: ms.spr.ly/6010avfyk

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Advancing semiconductor performance isn't just about smaller transistors.

Innovations in advanced packaging, like hybrid bonding, enable denser chip-to-chip connections and create new opportunities for performance and power efficiency. But bringing these technologies to life manufacturing precision.

Discover the engineering behind next-generation semiconductor packaging.

Watch the full conversation: ms.spr.ly/6011axei1

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Take a deeper dive into hybrid bonding with our Foveros Direct 3D technology brief: ms.spr.ly/6012axeiG

What does it really take to make the world's most advanced chips?

Thousands of intricate manufacturing steps. Extraordinary engineering precision. And an industry working to meet growing global demand for computing.

Get an inside look at Intel's semiconductor innovation as ade, and other Intel experts join @dwarkeshpodcast to explore the science, technology, and manufacturing expertise behind advanced chips.

Watch the full conversation: ms.spr.ly/6014aaFMm

We’re raising the roof on the first fab in Ohio.

The initial major structural truss is going up at the Intel Ohio site, marking another step toward strengthening U.S. semiconductor manufacturing leadership.

Read more: ms.spr.ly/6011avfJS

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AI needs faster, more efficient connectivity. Co-packaged optics (CPO) brings optics closer to compute, but scaling it reliably takes advances in manufacturing and packaging. At #SEMICONWest, Intel Foundry highlighted the collaboration needed to scale CPO for AI infrastructure.

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The future of semiconductor manufacturing depends on connected intelligence. Explore how metrology, AI, automation, and advanced packaging strategies can work together to improve yield, efficiency, and manufacturing autonomy.

Read more: ms.spr.ly/6017avSVL

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From idea to innovation, every chip starts with a vision.

With Intel Foundry, the possibilities are yours for the making. ms.spr.ly/6016avM2r

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Semiconductor innovation takes an ecosystem. At #SEMICONWest, Intel Foundry experts shared how advances in packaging, materials, metrology, and AI-enabled insights are helping bring innovation to scale with the quality and consistency that customers demand.

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Foveros 2.5D enables high-density interconnects and heterogeneous chiplet integration, giving designers flexibility to combine different dies, process nodes, and IP in a single package.

Learn more: ms.spr.ly/6016aSNIQ

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PDKs connect advanced process technology to the design flow.

Learn how Intel Foundry and @Synopsys are collaborating to bring innovations like PowerVia into customer designs and accelerate adoption of advanced nodes: ms.spr.ly/6018aqI6w

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American innovation has helped shape the semiconductor industry for decades.

From R&D to leading-edge manufacturing, Intel Foundry is investing in technology and capacity in the U.S. while helping build a more resilient semiconductor ecosystem.

See how we’re helping build whatlApeSNjHd

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Advancing semiconductor innovation in Oregon.

Congratulations to @LamResearch on its new Tualatin R&D lab. We look forward to building on our decades-long collaboration to accelerate process development for the AI era. ms.spr.ly/6017aUreh

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Hello from New Mexico, where Intel Foundry is reaching new heights.

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Advanced packaging is reshaping semiconductor manufacturing, enabling chiplets to work together as a system and scale performance for increasingly complex workloads.​

Explore Intel Foundry’s packaging leadership: ms.spr.ly/6011amLPl

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Learn more about Intel’s advanced packaging and manufacturing work in New Mexico: ms.spr.ly/6012amLPm

At #SEMICONWest, Lalitha Immaneni, VP of Semiconductor Research and Development at Intel, will discuss the future of advanced packaging during the CEO Summit Keynote.

Register here: ms.spr.ly/6014amLGr

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Arizona is helping shape the future of semiconductor manufacturing.

At Intel Foundry in Chandler, we're bringing leading-edge manufacturing to Arizona, with Intel 18A now being manufactured at the site.

Learn more: ms.spr.ly/6011amLBt

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AI is changing how we think about semiconductor scaling.

From power delivery and advanced packaging to AI-driven manufacturing, Intel Foundry is addressing the challenges shaping the future of AI systems.

Read more: ms.spr.ly/6016aWFhk

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Intel Foundry and @Applied4Tech are collaborating on transistor, interconnect, and advanced packaging innovations for AI computing, connecting R&D at Applied’s EPIC Center in Silicon Valley and Intel’s Oregon campus to accelerate the lab-to-fab pipeline in the U.S.

Learn more herewk

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