Renesas' new RX74M and RX74N flagship 32-bit MCUs combine a 600 MHZ RXv3e core with embedded MRAM for fast, reliable real-time performance in advanced industrial systems. Learn more: renesas.com/en/about/newsr…

In an interview with Physical AI magazine, Brad Rex, Head of Physical AI, explains how Renesas is bringing together power management and sensing expertise to advance humanoid robotics and help move AI into the physical world. Watch the full discussion: physicalai.today/videos/1906-re…

What does it take to make production-ready ADAS more accessible? Vivek Vasantha, Sr. Manager, HPC, explains how our Vision Pilot ADAS stack helps accelerate entry-level L2 ADAS development on the Renesas R-Car V4M platform. renesas.com/en/application…

Visit us at electronica 2026, November 10-13 at Booth C5.479 to experience demos of our power management, sensors, and microcontroller solutions for physical AI, SDVs, AI infrastructure, and IIoT. Save the date and we’ll see you at the show!

Our first 100V GaN family features four low-voltage FETs with ultra-fast switching speeds and enhanced thermal performance for efficiency-critical, high-power-density applications, such as AI data centers and robotics. Learn more: renesas.com/en/about/newsr…

Introducing the industry’s first 650V GaN device with dual-side cooling for high-density conversion in 800V AI data centers, delivering power density and space efficiency in an 8x8 mm footprint. Learn more: renesas.com/en/about/newsr…

AI inference brings huge energy demands & heat challenges. On the @PSD_Global podcast, Zaher Baidas, SVP & GM of Power, explains how we can redesign AI infrastructure to deliver power more efficiently from grid to core: powersystemsdesign.com/articles/psdca…

Our Physical AI & Robotics Lab in Beijing, featured by NHK World-Japan, helps customers validate and co-develop next-gen robots, from concept to deployment.
📺 bit.ly/3TzJziC

As OEMs invest more in SDVs, they need partners who reduce risks without taking away control. Vivek Bhan, SVP & GM of HPC, shares with @elektroniknet how Renesas goes beyond supplying components to give each OEM the flexibility their vision requires: elektroniknet.de/international/…

The industry's smallest GreenPAK configurable mixed-signal device is here. The SLG46801 features multi-time programmability and is available in WLCSP & STQFN packages, ideal for compact consumer devices that demand more functionality and power efficiency: renesas.com/en/about/newsr…

Thank you to everyone who stopped by our booth to experience our solutions firsthand at Electronica India and connect with our team.

The world is built for the human hand, and that's a challenge for robots.

At @embedded_comp AI at the Edge Day, Karthi Gopalan, VP of Business Strategy, unpacked these challenges and how analog can help us solve them.

Explore more solutions: renesas.com/en/application…

Proud to join the conversations shaping the future of semiconductors at #SEMICONIndia2026. From leadership and talent development to women driving innovation, Renesas was honored to contribute to the industry's next chapter. #Renesas #WomenInTech

What if embedded design moved as fast as innovation demands? Leigh Gawne and Hooman Foroughi explain how Renesas 365 brings together silicon, software, and lifecycle management in a single cloud-connected platform to enable smarter, faster design. renesas.com/en/blogs/renes…

We had a busy first day at electronica India! It’s been a pleasure showing visitors how our embedded solutions enable their AI, automotive, industrial, and consumer designs.

There's still time to join us! Stop by Hall 5, Stand H5.G31 to check out our demos.

The key to humanoid robotics deployment isn't designing the best components. It's building a new ecosystem. Ivo Marocco, VP & Head of UX and Technical Marketing, shares how we're building a connected ecosystem for efficient collaboration. renesas.com/en/blogs/beyon…

Demands on data centers are changing fast. In a conversation with @PowerElecWorld, Pietro Scalia, Head of Power System Architecture, unpacks the engineering challenges and opportunities shaping the next AI infrastructure breakthrough: powerelectronicsmagazine.net/video/987/AI_i…

Visit Renesas next week at electronica India 2026 in Hall 5, Stand H5.G31.

Stop by to learn how our embedded technologies are driving AI-powered automotive systems, industrial automation, integrated hardware-software development, and more. Register today:mmiconnect.in/ep-blr-2026/vi…

Join Brad Rex, Head of Physical AI, at the Humanoids Summit in Seoul on Sept. 23 for his keynote on the technologies bringing humanoid robotics to life. Then, stop by booth 26 to see our solutions in action. Register today: humanoidssummit.com

We’re expanding our MPU portfolio with the pin-compatible 64-bit RZ/G3L and RZ/G3SE, designed for advanced Human Machine Interface (HMI) and IoT Edge Systems that demand high processing performance and high-speed network connectivity. Learn more: renesas.com/en/about/newsr…